EP8109 is a single-component, modified epoxy resin adhesive designed for BGA & CSP underfill processes. It forms a uniform and defect-free underfill layer, effectively reducing stress caused by the mismatch in overall thermal expansion between the silicon chip and substrate or by external forces. After thermal curing, the adhesive enhances the mechanical strength of the chip connection and improves product performance, thereby extending the service life.

Storage and Shelf Life:
The product should be stored in vacuum-sealed aluminum foil bags in a dry environment at 15–25°C. The shelf life of unopened products is 6 months.

Health and Precautions:
Please refer to the Material Safety Data Sheet (MSDS) for proper handling and disposal instructions.

Important Information – Please Read Carefully:
The information provided herein is believed to be accurate. However, since the conditions and methods of using our products are beyond our control, this information cannot replace customer testing to ensure the product is safe, effective, and fully suitable for the intended application.

The recommendations provided should not be construed as infringing any patent rights. This document does not include all safety information required for the safe use of this product. Before use, please read the product, its safety data sheet, and container labels to obtain information regarding safe handling and potential health hazards.